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3DIC
2009
IEEE
178views Hardware» more  3DIC 2009»
15 years 7 days ago
Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs
This paper presents an analysis and comparison between synchronous and delay-insensitive asynchronous logic circuits on thermal distributions for investigating novel solutions to t...
Brent Hollosi, Tao Zhang, Ravi Sankar Parameswaran...