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    3DIC
    2009
    IEEE
    178views Hardware» more  3DIC 2009»
    Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs
    15 years 28 days ago
    Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs
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    This paper presents an analysis and comparison between synchronous and delay-insensitive asynchronous logic circuits on thermal distributions for investigating novel solutions to t...
    Brent Hollosi, Tao Zhang, Ravi Sankar Parameswaran...
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