Sciweavers
Explore
Publications
Books
Software
Tutorials
Presentations
Lectures Notes
Datasets
Labs
Conferences
Community
Upcoming
Conferences
Top Ranked Papers
Most Viewed Conferences
Conferences by Acronym
Conferences by Subject
Conferences by Year
Tools
PDF Tools
Image Tools
Text Tools
OCR Tools
Symbol and Emoji Tools
On-screen Keyboard
Latex Math Equation to Image
Smart IPA Phonetic Keyboard
Community
Sciweavers
About
Terms of Use
Privacy Policy
Cookies
102
click to vote
DSD
2009
IEEE
84
views
Hardware
»
more
DSD 2009
»
Temperature- and Cost-Aware Design of 3D Multiprocessor Architectures
15 years 10 months ago
Download
vlsicad.ucsd.edu
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
Ayse Kivilcim Coskun, Andrew B. Kahng, Tajana Simu...
claim paper
Read More »