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104
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ICCAD
2004
IEEE
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ICCAD 2004
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Interconnect lifetime prediction under dynamic stress for reliability-aware design
16 years 11 days ago
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www.cs.virginia.edu
Thermal effects are becoming a limiting factor in highperformance circuit design due to the strong temperaturedependence of leakage power, circuit performance, IC package cost and...
Zhijian Lu, Wei Huang, John Lach, Mircea R. Stan, ...
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