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205
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ISPD
2011
ACM
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ISPD 2011
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Assembling 2D blocks into 3D chips
14 years 5 months ago
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www.eecs.umich.edu
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
Johann Knechtel, Igor L. Markov, Jens Lienig
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