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116
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ISQED
2009
IEEE
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Hardware
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ISQED 2009
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Simultaneous buffer and interlayer via planning for 3D floorplanning
15 years 10 months ago
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learn.tsinghua.edu.cn
As technology advances, the interconnect delay among modules plays dominant role in chip performance. Buffer insertion, as a traditional approach to reduce wire delay in 2D ICs, i...
Xu He, Sheqin Dong, Yuchun Ma, Xianlong Hong
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