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140
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DAC
1999
ACM
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Computer Architecture
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DAC 1999
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Reducing Cross-Coupling Among Interconnect Wires in Deep-Submicron Datapath Design
15 years 7 months ago
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www.cecs.uci.edu
As the CMOS technology enters the deep submicron design era, the lateral inter-wire coupling capacitance becomes the dominant part of load capacitance and makes RC delay on the bu...
Joon-Seo Yim, Chong-Min Kyung
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