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115
Voted
HPCA
2009
IEEE
212
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Distributed And Parallel Com...
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HPCA 2009
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A low-radix and low-diameter 3D interconnection network design
16 years 3 months ago
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www.cs.pitt.edu
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...
Bo Zhao, Jun Yang 0002, Xiuyi Zhou, Yi Xu, Youtao ...
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