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136
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ICCAD
2009
IEEE
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ICCAD 2009
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MOLES: Malicious off-chip leakage enabled by side-channels
15 years 15 days ago
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www.rfid-cusp.org
Economic incentives have driven the semiconductor industry to separate design from fabrication in recent years. This trend leads to potential vulnerabilities from untrusted circui...
Lang Lin, Wayne Burleson, Christof Paar
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