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    ICCAD
    2009
    IEEE
    136views Hardware» more  ICCAD 2009»
    Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
    15 years 15 days ago
    Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
    Download  www.gtcad.gatech.edu
    Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
    Young-Joon Lee, Rohan Goel, Sung Kyu Lim
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