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112
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ICCAD
2010
IEEE
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ICCAD 2010
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Multi-Wafer Virtual Probe: Minimum-cost variation characterization by exploring wafer-to-wafer correlation
15 years 22 days ago
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www.ece.cmu.edu
In this paper, we propose a new technique, referred to as MultiWafer Virtual Probe (MVP) to efficiently model wafer-level spatial variations for nanoscale integrated circuits. Tow...
Wangyang Zhang, Xin Li, Emrah Acar, Frank Liu, Rob...
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