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119
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PATMOS
2005
Springer
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Modeling and Simulation
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PATMOS 2005
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Efficient Simulation of Power/Ground Networks with Package and Vias
15 years 8 months ago
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As the number of metal layers and the frequency of VLSI continue to increase, the voltage droop on both the package and vias is becoming more pronounced. This paper analyzes the nu...
Jin Shi, Yici Cai, Xianlong Hong, Sheldon X.-D. Ta...
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