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GLVLSI
2009
IEEE
262views VLSI» more  GLVLSI 2009»
13 years 4 months ago
Power distribution paths in 3-D ICS
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
Vasilis F. Pavlidis, Giovanni De Micheli
VLSI
2010
Springer
13 years 4 months ago
Design and feasibility of multi-Gb/s quasi-serial vertical interconnects based on TSVs for 3D ICs
—This paper proposes a novel technique to exploit the high bandwidth offered by through silicon vias (TSVs). In the proposed approach, synchronous parallel 3D links are replaced ...
Fengda Sun, Alessandro Cevrero, Panagiotis Athanas...