Sciweavers

    MR
    2007
    93views Robotics» more  MR 2007»
    Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
    15 years 2 months ago
    Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
    Download  www.imec.be
    The development of a simplified analytical model to describe the thermal history of a Printed Circuit Board assembly (PCA) during convective reflow soldering is described in this ...
    Nele Van Steenberge, Paresh Limaye, Geert Willems,...
    claim paper
    Read More »
    Explore & Download
    Proceedings Preprints Top 5 Ranked Papers Publications Books Software Tutorials Presentations Lectures Notes Datasets
    Productivity Tools
    i2PDF i2Img i2Text i2OCR i2Symbol i2Type i2Speak i2Style i2Arabic i2Bopomo Latex Equation Editor
    Sciweavers
    About Community Cookies Privacy Policy Terms of Use

    Copyright © Sciweavers LLC, 2009-2026, USA.