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124
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DATE
2009
IEEE
113
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DATE 2009
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New simulation methodology of 3D surface roughness loss for interconnects modeling
15 years 10 months ago
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www.ida.liu.se
— As clock frequencies exceed giga-Hertz, the extra power loss due to conductor surface roughness in interconnects and packagings is more evident and thus demands a proper accou...
Quan Chen, Ngai Wong
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