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134
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ICPP
2008
IEEE
90
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Distributed And Parallel Com...
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ICPP 2008
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Thermal Management for 3D Processors via Task Scheduling
15 years 9 months ago
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www.cs.pitt.edu
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
Xiuyi Zhou, Yi Xu, Yu Du, Youtao Zhang, Jun Yang 0...
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