Sciweavers
Explore
Publications
Books
Software
Tutorials
Presentations
Lectures Notes
Datasets
Labs
Conferences
Community
Upcoming
Conferences
Top Ranked Papers
Most Viewed Conferences
Conferences by Acronym
Conferences by Subject
Conferences by Year
Tools
PDF Tools
Image Tools
Text Tools
OCR Tools
Symbol and Emoji Tools
On-screen Keyboard
Latex Math Equation to Image
Smart IPA Phonetic Keyboard
Community
Sciweavers
About
Terms of Use
Privacy Policy
Cookies
148
click to vote
ETS
2010
IEEE
174
views
Hardware
»
more
ETS 2010
»
Test-architecture optimization for TSV-based 3D stacked ICs
15 years 4 months ago
Download
people.ee.duke.edu
Testing of 3D stacked ICs (SICs) is becoming increasingly important in the semiconductor industry. In this paper, we address the problem of test architecture optimization for 3D s...
Brandon Noia, Sandeep Kumar Goel, Krishnendu Chakr...
claim paper
Read More »