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TCAD
2008
114views more  TCAD 2008»
14 years 8 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
76
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IPPS
2005
IEEE
15 years 2 months ago
Using Performance Counters for Runtime Temperature Sensing in High-Performance Processors
As energy consumption in high-performance systems has increased, thermal management has become a big challenge. Providing a cost-effective and detailed temperature sensing mechani...
Kyeong-Jae Lee, Kevin Skadron