178
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TCAD
2008
15 years 4 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
131
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IPPS
2005
IEEE
15 years 10 months ago
2005
IEEE
As energy consumption in high-performance systems has increased, thermal management has become a big challenge. Providing a cost-effective and detailed temperature sensing mechani...