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131
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ICCAD
2003
IEEE
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ICCAD 2003
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Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach
16 years 15 days ago
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www.ece.umn.edu
As the technology node progresses, thermal problems are becoming more prominent especially in the developing technology of three-dimensional (3D) integrated circuits. The thermal ...
Brent Goplen, Sachin S. Sapatnekar
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