73
Voted
ASPDAC
2008
ACM
14 years 11 months ago
2008
ACM
: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
HPCA
2002
IEEE
15 years 2 months ago
2002
IEEE
This paper proposes the use of formal feedback control theory as a way to implement adaptive techniques in the processor architecture. Dynamic thermal management (DTM) is used as ...