Sciweavers

ISQED
2002
IEEE
137views Hardware» more  ISQED 2002»
14 years 5 days ago
A Comprehensive Layout Methodology and Layout-Specific Circuit Analyses for Three-Dimensional Integrated Circuits
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
Syed M. Alam, Donald E. Troxel, Carl V. Thompson
DATE
2009
IEEE
183views Hardware» more  DATE 2009»
14 years 2 months ago
SunFloor 3D: A tool for Networks On Chip topology synthesis for 3D systems on chips
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...
Ciprian Seiculescu, Srinivasan Murali, Luca Benini...
DAC
2007
ACM
14 years 8 months ago
Placement of 3D ICs with Thermal and Interlayer Via Considerations
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Brent Goplen, Sachin S. Sapatnekar