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ISLPED
2006
ACM
99views Hardware» more  ISLPED 2006»
15 years 10 months ago
Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
Hao Yu, Yiyu Shi, Lei He, Tanay Karnik