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143
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ISLPED
2006
ACM
99
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ISLPED 2006
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Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power
15 years 9 months ago
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www.ee.ucla.edu
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
Hao Yu, Yiyu Shi, Lei He, Tanay Karnik
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