Sciweavers
Explore
Publications
Books
Software
Tutorials
Presentations
Lectures Notes
Datasets
Labs
Conferences
Community
Upcoming
Conferences
Top Ranked Papers
Most Viewed Conferences
Conferences by Acronym
Conferences by Subject
Conferences by Year
Tools
PDF Tools
Image Tools
Text Tools
OCR Tools
Symbol and Emoji Tools
On-screen Keyboard
Latex Math Equation to Image
Smart IPA Phonetic Keyboard
Community
Sciweavers
About
Terms of Use
Privacy Policy
Cookies
106
click to vote
ICCAD
2002
IEEE
73
views
Hardware
»
more
ICCAD 2002
»
Shaping interconnect for uniform current density
15 years 11 months ago
Download
www.cs.york.ac.uk
As the VLSI technology scaling down, the electromigration problem becomes one of the major concerns in high-performance IC design for both power network and signal interconnects. ...
Muzhou Shao, D. F. Wong, Youxin Gao, Li-Pen Yuan, ...
claim paper
Read More »