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104
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GLVLSI
2005
IEEE
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GLVLSI 2005
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Interconnect delay minimization through interlayer via placement in 3-D ICs
15 years 9 months ago
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www.ece.rochester.edu
The dependence of the propagation delay of the interlayer 3-D interconnects on the vertical through via location and length is investigated. For a variable vertical through via lo...
Vasilis F. Pavlidis, Eby G. Friedman
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