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119
Voted
GLVLSI
2006
IEEE
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VLSI
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GLVLSI 2006
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Measurement and characterization of pattern dependent process variations of interconnect resistance, capacitance and inductance
15 years 9 months ago
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www-tcad.stanford.edu
Process variations have become a serious concern for nanometer technologies. The interconnect and device variations include interand intra-die variations of geometries, as well as...
Xiaoning Qi, Alex Gyure, Yansheng Luo, Sam C. Lo, ...
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