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ICCAD
2002
IEEE
73views Hardware» more  ICCAD 2002»
15 years 10 months ago
Shaping interconnect for uniform current density
As the VLSI technology scaling down, the electromigration problem becomes one of the major concerns in high-performance IC design for both power network and signal interconnects. ...
Muzhou Shao, D. F. Wong, Youxin Gao, Li-Pen Yuan, ...