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DAC
2009
ACM

Double patterning lithography friendly detailed routing with redundant via consideration

10 years 2 months ago
Double patterning lithography friendly detailed routing with redundant via consideration
In double patterning lithography (DPL), coloring conflict and stitch minimization are the two main challenges. Post layout decomposition algorithm [1] [2]may not be enough to achieve high quality solution for DPL-unfriendly designs, due to complex 2D patterns in lower metal layers. Therefore, DPL-friendliness is needed at routing stage [3]. Another key yield improvement technique is redundant via insertion [4] [5]. However, this would increase the complexity in DPL-compliance. To make designs manufacturable in DPL, we should not insert a redundant via if it results in coloring conflict. This paper is the first work to consider DPL and redundant via together. We have developed two algorithms, post-routing DPL-aware insertion and DPL-friendly routing with redundant via consideration to take into account redundant via DPL-compliance. Experimental results show that, compared to a DPL-aware optimization flow without redundant via consideration, we can improve insertion rate by 43% while st...
Kun Yuan, Katrina Lu, David Z. Pan
Added 12 Nov 2009
Updated 12 Nov 2009
Type Conference
Year 2009
Where DAC
Authors Kun Yuan, Katrina Lu, David Z. Pan
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