34 search results - page 6 / 7 » 3D floorplanning with thermal vias |
ASPDAC
2006
ACM
13 years 9 months ago
2006
ACM
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
ASPDAC
2005
ACM
13 years 11 months ago
2005
ACM
3-D IC has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-on-chip or system-in-package solutions. A cr...
ICCAD
2001
IEEE
14 years 2 months ago
2001
IEEE
This paper presents both compact analytical models and fast SPICE based 3-D electro-thermal simulation methodology to characterize thermal effects due to Joule heating in high per...
DAC
2009
ACM
14 years 6 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
ASPDAC
2008
ACM
13 years 7 months ago
2008
ACM
The capability of predicting the temperature profile is critically important for timing estimation, leakage reduction, power estimation, hotspot avoidance and reliability concerns ...