89 search results - page 1 / 18 » A Statistical Model for Electromigration Failures |
ISQED
2000
IEEE
13 years 9 months ago
2000
IEEE
The lognormal has been traditionally used to model the failure time distribution of electromigration failures. However, when used to estimate the failure of large metal layers, it...
DFT
2007
IEEE
13 years 11 months ago
2007
IEEE
During semiconductor manufacturing, particles undesirably depose on the surface of the wafer causing “open” and “short” defects to interconnects. In this paper, a third ty...
DFT
2004
IEEE
13 years 8 months ago
2004
IEEE
We present a model for computing the probability of a parametric failure due to a spot defect. The analysis is based on electromigration in conductors under unidirectional current...
ANSS
2007
IEEE
13 years 11 months ago
2007
IEEE
Accurate failure prediction in Grids is critical for reasoning about QoS guarantees such as job completion time and availability. Statistical methods can be used but they suffer f...
ASPDAC
2007
ACM
13 years 9 months ago
2007
ACM
Single-walled carbon nanotube (SWCNT) bundles have the potential to provide an attractive solution for the resistivity and electromigration problems faced by traditional copper int...