3 search results - page 1 / 1 » A multilevel analytical placement for 3D ICs |
ASPDAC
2009
ACM
13 years 11 months ago
2009
ACM
DAC
2007
ACM
14 years 5 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
ASPDAC
2005
ACM
13 years 10 months ago
2005
ACM
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...