5 search results - page 1 / 1 » An Integrated Flow for Technology Remapping and Placement of... |
ASPDAC
1998
ACM
13 years 9 months ago
1998
ACM
ABSTRACT - This paper presents a new design flow, FPDSiMPA, and a set of techniques for synthesizing high-performance sub-half micron logic circuits. FPD-SiMPA consists of logic p...
ASPDAC
2011
ACM
12 years 8 months ago
2011
ACM
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
FPGA
2009
ACM
13 years 11 months ago
2009
ACM
Carbon nanotubes (CNTs), with their unique electronic properties, are promising materials for building nanoscale circuits. In this paper, we present a new CNT-based FPGA architect...
SLIP
2009
ACM
13 years 11 months ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
DAC
2009
ACM
14 years 5 months ago
2009
ACM
As VLSI technology enters the nanoscale regime, interconnect delay has become the bottleneck of the circuit timing. As one of the most powerful techniques for interconnect optimiz...