3 search results - page 1 / 1 » Assembling 2D blocks into 3D chips |
ISPD
2011
ACM
12 years 7 months ago
2011
ACM
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
GLVLSI
2006
IEEE
13 years 10 months ago
2006
IEEE
In modern IC design, the number of long on-chip wires has been growing rapidly because of the increasing circuit complexity. Interconnect delay has dominated over gate delay as te...
CF
2006
ACM
13 years 8 months ago
2006
ACM
The slowing pace of commodity microprocessor performance improvements combined with ever-increasing chip power demands has become of utmost concern to computational scientists. As...