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MICRO
2007
IEEE
150views Hardware» more  MICRO 2007»
13 years 11 months ago
Leveraging 3D Technology for Improved Reliability
Aggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower sup...
Niti Madan, Rajeev Balasubramonian
DAC
2009
ACM
14 years 6 months ago
Dynamic thermal management via architectural adaptation
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
Ramkumar Jayaseelan, Tulika Mitra
ISLPED
2005
ACM
108views Hardware» more  ISLPED 2005»
13 years 11 months ago
Replacing global wires with an on-chip network: a power analysis
This paper explores the power implications of replacing global chip wires with an on-chip network. We optimize network links by varying repeater spacing, link pipelining, and volt...
Seongmoo Heo, Krste Asanovic
ASPLOS
2004
ACM
13 years 10 months ago
Heat-and-run: leveraging SMT and CMP to manage power density through the operating system
Power density in high-performance processors continues to increase with technology generations as scaling of current, clock speed, and device density outpaces the downscaling of s...
Mohamed A. Gomaa, Michael D. Powell, T. N. Vijayku...
VLSID
2006
IEEE
183views VLSI» more  VLSID 2006»
13 years 11 months ago
Design Challenges for High Performance Nano-Technology
This tutorial present the key aspects of design challenges and its solutions that are being experienced in VLSI design in the era of nano technology. The focus will be on design c...
Goutam Debnath, Paul J. Thadikaran