76 search results - page 2 / 16 » Dynamic thermal management in 3D multicore architectures |
DAC
2008
ACM
14 years 6 months ago
2008
ACM
Achieving high performance under a peak temperature limit is a first-order concern for VLSI designers. This paper presents a new model of a thermally-managed system, where a stoch...
ICCAD
2009
IEEE
13 years 2 months ago
2009
IEEE
Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have ne...
MJ
2011
12 years 12 months ago
2011
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
—Dynamic Thermal Management techniques have been widely accepted as a thermal solution for their low cost and simplicity. The techniques have been used to manage the heat dissipa...
DAC
2009
ACM
13 years 11 months ago
2009
ACM
It is known that temperature gradients and thermal hotspots affect the reliability of microprocessors. Temperature is also an important constraint when maximizing the performance...