6 search results - page 1 / 2 » Fabrication of 3D Packaging TSV using DRIE |
CORR
2008
Springer
13 years 4 months ago
2008
Springer
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
DATE
2010
IEEE
13 years 9 months ago
2010
IEEE
—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...
CORR
2008
Springer
13 years 4 months ago
2008
Springer
Abstract-Two dimensional (2D) integration has been the traditional approach for IC integration. Increasing demands for providing electronic devices with superior performance and fu...
ISCAS
2006
IEEE
13 years 10 months ago
2006
IEEE
We fabricated a 3D-integrated multi-chip sensor separate dies [9]. In this paper, we present a 3D integrated and actuator and demonstrated the ability of communication with tempera...
ISCAS
2005
IEEE
13 years 10 months ago
2005
IEEE
— We designed a 3D integrated multi-chip module that uses non-galvanic capacitive coupling to provide bi-directional communication and exchange power supply between two separate ...