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3DIC
2009
IEEE
279views Hardware» more  3DIC 2009»
14 years 21 hour ago
Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, ...
DAC
1998
ACM
13 years 9 months ago
Adjoint Transient Sensitivity Computation in Piecewise Linear Simulation
This paper presents a general method for computing transient sensitivities using the adjoint method in event driven simulation algorithms that employ piecewise linear device model...
Tuyen V. Nguyen, Anirudh Devgan, Ognen J. Nastov
VLSID
2000
IEEE
102views VLSI» more  VLSID 2000»
13 years 9 months ago
Inductance Characterization of Small Interconnects Using Test-Signal Method
The test signal method can be used to measure and model inductance parameters (self and mutual) of a very small interconnect especially in highdensity IC’s by using a test signa...
Jeegar Tilak Shah, Madhav P. Desai, Sugata Sanyal
TCAD
2010
98views more  TCAD 2010»
12 years 12 months ago
Statistical Modeling With the PSP MOSFET Model
PSP and the backward propagation of variance (BPV) method are used to characterize the statistical variations of metal-oxide-semiconductor field effect transistors (MOSFETs). BPV s...
Xin Li, Colin C. McAndrew, Weimin Wu, Samir Chaudh...
CCECE
2006
IEEE
13 years 11 months ago
Linearization Techniques for Cross-Coupled Transconductor Circuits Used in Integrated Q-Enhanced LC Filters
Integrated Q-enhanced RF LC filters using negative resistances implemented using cross coupled pairs frequently suffer from poor linearity performance. Several linearization met...
Holly Pekau, Jim Kulyk, James W. Haslett, Leonid B...