—When manufacturing nano-devices, defects are a certainty and reliability becomes a critical issue. Until now, the most pervasive methods used to address reliability, involve inj...
Application details uncertain at design time as well as tolerance against permanent resource defects demand flexibility and redundancy. In this context, we present a strategy for p...
As manufacturing technology enters the ultra-deep submicron era, wafer yields are destined to drop due to higher occurrence of physical defects on the die. This paper proposes a y...
Nicola Campregher, Peter Y. K. Cheung, George A. C...
—The very high levels of integration and submicron device sizes used in current and emerging VLSI technologies for FPGAs lead to higher occurrences of defects and operational fau...
With advances in process technology, the feature sizes are decreasing, which leads to higher defect densities. More sophisticated techniques, at increased costs are required to av...