Continuing improvements in semiconductor density are enabling new classes of System-on-a-Chip architectures that combine extensive processing logic and high-density memory. Many o...
David L. Landis, Paul T. Hulina, Scott Deno, Luke ...
There is a dramatic logic density gap between FPGAs and ASICs, and this gap is the main reason FPGAs are not cost-effective in high volume applications. Modern FPGAs narrow this ga...
Abstract-- Increasing device densities allow chip manufacturers to integrate more functionality onto a single piece of silicon. FPGA manufacturers, such as Xilinx and Altera, use t...
State elements are increasingly vulnerable to soft errors due to their decreasing size, and the fact that latched errors cannot be completely eliminated by electrical or timing ma...
Continuing improvements in semiconductor fabrication density are enabling new classes of System-on-aChip architectures that combine extensive processing logic and high-density mem...
Luke Roth, Lee D. Coraor, David L. Landis, Paul T....