11 search results - page 1 / 3 » Keeping hot chips cool |
DAC
2008
ACM
13 years 6 months ago
2008
ACM
level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart pro...
DAC
2005
ACM
13 years 6 months ago
2005
ACM
With 90nm CMOS in production and 65nm testing in progress, power has been pushed to the forefront of design metrics. This paper will outline practical techniques that are used to ...
ISQED
2010
IEEE
13 years 10 months ago
2010
IEEE
- In this paper, we propose a thermal-aware job allocation and scheduling algorithm for three-dimensional (3D) chip multiprocessor (CMP). The proposed algorithm assigns hot jobs to...
TVLSI
2008
13 years 4 months ago
2008
Thermal management is critical for integrated circuit (IC) design. With each new IC technology generation, feature sizes decrease, while operating speeds and package densities incr...
ISPASS
2008
IEEE
13 years 11 months ago
2008
IEEE
The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor’s reliabili...