19 search results - page 2 / 4 » Limitations of self-assembly at temperature 1 |
DNA
2008
Springer
13 years 6 months ago
2008
Springer
In this paper, we search for theoretical limitations of the Tile Assembly Model (TAM), along with techniques to work around such limitations. Specifically, we investigate the self...
DAC
2007
ACM
14 years 5 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
ASPDAC
2012
ACM
12 years 15 days ago
2012
ACM
Abstract— Integrating optical interconnects into the nextgeneration multi-/many-core architecture has been considered a viable solution to addressing the limitations in throughpu...
FOCS
1993
IEEE
13 years 9 months ago
1993
IEEE
We resolve in the a rmative a question of Boppana and Bui: whether simulated annealing can, with high probability and in polynomial time, nd the optimal bisection of a random grap...
DFT
2006
IEEE
13 years 10 months ago
2006
IEEE
1 High temperature has become a major problem for system-on-chip testing. In order to reduce the test time while keeping the temperature of the chip under test within a safe range,...