26 search results - page 1 / 6 » MCM placement using a realistic thermal model |
GLVLSI
2000
IEEE
13 years 9 months ago
2000
IEEE
— Typically, placement algorithms attempt to minimize the total net length of a printed circuit board (PCB). However, an MCM’s increased throughput and dense circuitry can easi...
ICCD
2005
IEEE
14 years 1 months ago
2005
IEEE
Thermal management in microprocessors has become a major design challenge in recent years. Thermal monitoring through hardware sensors is important, and these sensors must be care...
ISPD
2003
ACM
13 years 10 months ago
2003
ACM
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
ICCAD
2001
IEEE
14 years 1 months ago
2001
IEEE
This paper presents both compact analytical models and fast SPICE based 3-D electro-thermal simulation methodology to characterize thermal effects due to Joule heating in high per...
EUROGRAPHICS
2010
Eurographics
14 years 2 months ago
2010
Eurographics
This paper presents a physically based method for simulating the heat transfers between the different environmental elements to synthesize realistic winter sceneries. We simulate ...