— Typically, placement algorithms attempt to minimize the total net length of a printed circuit board (PCB). However, an MCM’s increased throughput and dense circuitry can easi...
Thermal management in microprocessors has become a major design challenge in recent years. Thermal monitoring through hardware sensors is important, and these sensors must be care...
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
This paper presents both compact analytical models and fast SPICE based 3-D electro-thermal simulation methodology to characterize thermal effects due to Joule heating in high per...
This paper presents a physically based method for simulating the heat transfers between the different environmental elements to synthesize realistic winter sceneries. We simulate ...
Nicolas Maréchal, Eric Guérin, Eric Galin, Stép...