7 search results - page 1 / 2 » Noise constraint driven placement for mixed signal designs |
ISCAS
2003
IEEE
13 years 10 months ago
2003
IEEE
ASPDAC
2007
ACM
13 years 8 months ago
2007
ACM
This paper proposes Noise-Direct, a design methodology for power integrity aware floorplanning, using microarchitectural feedback to guide module placement. Stringent power constr...
DAC
1996
ACM
13 years 9 months ago
1996
ACM
A novel methodology for circuit design and automatic layout generation is proposed for a class of mixed-signal circuits in presence of layout parasitics and substrate induced nois...
GLVLSI
2005
IEEE
13 years 10 months ago
2005
IEEE
3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
ISQED
2008
IEEE
13 years 11 months ago
2008
IEEE
– As silicon technology scales, we can integrate more and more circuits on a single chip, which means more I/Os are needed in modern designs. The flip-chip technology which was ...