18 search results - page 2 / 4 » On Thermal Effects in Deep Sub-Micron VLSI Interconnects |
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
With shrinking feature size and growing integration density in the Deep Sub-Micron technologies, the global buses are fast becoming the “weakest-links” in VLSI design. They ha...
ICCD
2004
IEEE
14 years 1 months ago
2004
IEEE
In Deep Sub-Micron (DSM) technologies, interconnects play a crucial role in the correct functionality and largely impact the performance of complex System-on-Chip (SoC) designs. F...
GLVLSI
2003
IEEE
13 years 10 months ago
2003
IEEE
One of the fundamental problems in Deep Sub Micron (DSM) circuits is Simultaneous Switching Noise (SSN), which causes voltage fluctuations in the circuit power/ground networks. In...
ICCAD
2001
IEEE
14 years 1 months ago
2001
IEEE
In deep submicron VLSI circuits, interconnect reliability due to electromigration and thermal effects is fast becoming a serious design issue particularly for long signal lines. T...
DATE
2004
IEEE
13 years 8 months ago
2004
IEEE
With the increasing power density and heat-dissipation cost of modern VLSI designs, thermal and power integrity has become serious concern. Although the impacts of thermal effects...