3 search results - page 1 / 1 » On the complexity of graph cuboidal dual problems for 3-D fl... |
GLVLSI
2009
IEEE
2009
IEEE
On the complexity of graph cuboidal dual problems for 3-D floorplanning of integrated circuit design
13 years 11 months ago
This paper discusses the impact of migrating from 2-D to 3-D on floorplanning and placement. By looking at a basic formulation of graph cuboidal dual problem, we show that the 3-...
GLVLSI
2006
IEEE
13 years 11 months ago
2006
IEEE
In modern IC design, the number of long on-chip wires has been growing rapidly because of the increasing circuit complexity. Interconnect delay has dominated over gate delay as te...
ICCAD
2007
IEEE
14 years 1 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...