11 search results - page 2 / 3 » Post-routing redundant via insertion for yield reliability i... |
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
- Redundant via insertion and line end extension employed in the post-routing stage are two well known and highly recommended techniques to reduce yield loss due to via failure. Ho...
DAC
2009
ACM
14 years 5 months ago
2009
ACM
In double patterning lithography (DPL), coloring conflict and stitch minimization are the two main challenges. Post layout decomposition algorithm [1] [2]may not be enough to achi...
TCAD
2008
13 years 4 months ago
2008
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures due to the copper cladding process. To improve via yield and reliability, ...
DAC
2006
ACM
14 years 5 months ago
2006
ACM
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highl...
DAC
2007
ACM
14 years 5 months ago
2007
ACM
Twisted differential line structure can effectively reduce crosstalk noise on global bus, which foresees a wide applicability. However, measured performance based on fabricated ci...