23 search results - page 2 / 5 » Power distribution paths in 3-D ICS |
DAC
2011
ACM
12 years 4 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
DAC
2009
ACM
14 years 5 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
ISQED
2007
IEEE
13 years 11 months ago
2007
IEEE
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
SLIP
2009
ACM
13 years 11 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...