232 search results - page 1 / 47 » Practical aspects of reliability analysis for IC designs |
DAC
2006
ACM
13 years 11 months ago
2006
ACM
DAC
2006
ACM
14 years 6 months ago
2006
ACM
Recent progress in EDA tools allows IC designs to be accurately verified with consequent improvements in yield and performance through reduced guard bands. This paper will present...
DAC
2012
ACM
11 years 7 months ago
2012
ACM
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
DATE
2006
IEEE
13 years 11 months ago
2006
IEEE
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...