37 search results - page 4 / 8 » Prediction of Power Requirements for High-Speed Circuits |
GLVLSI
2006
IEEE
14 years 1 days ago
2006
IEEE
This paper introduces a standard cell based design for a Serializer and Deserializer (SerDes) communication link. The proposed design is area, power and design time efficient as c...
MICRO
2008
IEEE
14 years 11 days ago
2008
IEEE
Shrinking transistor sizes and a trend toward low-power processors have caused increased leakage, high per-device variation and a larger number of hard and soft errors. Maintainin...
DATE
2007
IEEE
14 years 10 days ago
2007
IEEE
—Increasing power density causes die overheating due to limited cooling capacity of the package. Conventional thermal management techniques e.g. logic shutdown, clock gating, fre...
ISLPED
2003
ACM
13 years 11 months ago
2003
ACM
Power dissipation is unevenly distributed in modern microprocessors leading to localized hot spots with significantly greater die temperature than surrounding cooler regions. Exc...
DAC
2002
ACM
14 years 7 months ago
2002
ACM
In this paper we propose a novel integrated circuit and architectural level technique to reduce leakage power consumption in high performance cache memories using single Vt (trans...