With ever-increasing power density and cooling costs in modern high-performance systems, dynamic thermal management (DTM) has emerged as an effective technique for guaranteeing th...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
Abstract. With more cores integrated into one single chip, the overall power consumption from the multiple concurrent running programs increases dramatically in a CMP processor whi...
—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...