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VLSID
2010
IEEE
202views VLSI» more  VLSID 2010»
13 years 2 months ago
Processor Architecture Design Using 3D Integration Technology
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, is one of the promising solutions to mitigate the interconnect...
Yuan Xie
CF
2008
ACM
13 years 6 months ago
A modular 3d processor for flexible product design and technology migration
The current methodology used in mass-market processor design is to create a single base microarchitecture (e.g., Intel's "Core"or AMD's"K8") that is ...
Gabriel H. Loh
ICCD
2005
IEEE
110views Hardware» more  ICCD 2005»
14 years 1 months ago
Implementing Caches in a 3D Technology for High Performance Processors
3D integration is an emergent technology that has the potential to greatly increase device density while simultaneously providing faster on-chip communication. 3D fabrication invo...
Kiran Puttaswamy, Gabriel H. Loh
VLSID
2007
IEEE
146views VLSI» more  VLSID 2007»
14 years 5 months ago
Architecting Microprocessor Components in 3D Design Space
Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional ...
Balaji Vaidyanathan, Wei-Lun Hung, Feng Wang 0004,...
MICRO
2007
IEEE
150views Hardware» more  MICRO 2007»
13 years 11 months ago
Leveraging 3D Technology for Improved Reliability
Aggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower sup...
Niti Madan, Rajeev Balasubramonian